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Ceramic Packages

Side-Brazed Dual In-Line Ceramic Package(SBDIP)

Ceramic Quad Flat Package - Cerquad

Flat Packs(CQFP,CQFJ)/Leaded Chip Carriers(LDCC)

No-lead Flat Pack(QFN)/Leadless Chip Carrier (LCC)

Small Outline Integrated Circuit Package (SOIC)

Ceramic Pin Grid Arrays (CPGA)

Ceramic Dual-Inline Package (CDIP / CerDIP)

Ceramic Pack Package(CerPac)

Hybrid Package - Multi-enip Module (MCM)

Hermetic Surface Mount Device (SMD) Packages

Power Surface Mount Packages

LED Package


Metal Packages

Transistor Outlines - TO Headers

Advanced Electronic Packages

Advanced Opto-electronic Packages


Plastic Packages

Open Cavity QFN Package


Lids and Covers

Plastic Lids

Combo Lids

Glass Lids

Ceramic Lids

TO Cans

Lid With Hydrogen & Moisture Getters


Connectors

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Circular and Rectangular Connectors

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Headers and Feedthrus

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Specials and Customer Designs


Burn-in & Test Sockets (Part A)


BGA/LGA/FBGA Sockets

QFP Sockets

SOP Sockets

TSOP Sockets

PLCC Sockets

LDCC Sockets


Burn-in & Test Sockets (Part B)

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Axial,Radial & MELF Sockets

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BGA/CSP Sockets

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Connectors

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DIP Sockets

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FlatPack Sockets

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Gull Wing Sockets

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LCC w/Castellations Sockets

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LGA Sockets

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Microwave/Hybrid Sockets

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Optical Transceiver Sockets

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PGA Sockets

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PLCC/SOJ Sockets

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QFN Sockets

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SIP Sockets

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SMD Sockets

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Socket Accessories

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TO Sockets

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ZigZag Sockets




Burn-in & Test Sockets (Part C)

Open-top BGA Sockets

QFN/CSP Sockets

uPGA(Micro PGA) Sockets

Land Grid Array (LGA) Sockets

PLCC Sockets

LCC Sockets

SO Sockets

QFP/TQFP Sockets

SOJ Sockets

SSOP Sockets

BGA Sockets

mBGA Sockets


Burn-in & Test Sockets (Part D)


BGA Sockets

QFN Sockets



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