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Small Outline Integrated Circuit Package (SOIC)


The SOIC includes the popular "gullwing" and "J-bend" lead shape.It has been proved with surface mount performance characteristics and has been designed to adopt easily to all SMT processes and lines.The SOIC meet the need for dense placement of chips on boards. It is with .050" lead spacing. Ceramic SOICs typically come in 8- 28 leads. We also provide plastic version of SOIC with various Lead count.


Features:

  • Surface Mount Package
  • Broad die pad selection
  • Comparable Foot Print With Wide Body SOP Plastic Packaging
  • High conductivity copper leadframes
  • J-bend and Gull Wing Lead Configuration
  • Solder plate lead finish(Pb-Sn,Sn-Bi,Matte Sn available)


SOIC part list:


Part Number Lead Count Package Type Reference Drawing Cavity Size Pkg OD Thickness Lead Pitch
(W) (L) (L) (W)
SOIC0801 8 SOIC G1616M-1F 0.07 0.09 0.18 0.18 0.057 0.05
SOIC1601 16 SOIC PB-F88151-JMI 0.17 0.283 0.411 0.293 0.078 0.05
SOIC1602 16 SOIC PB-F88151 0.17 0.283 0.411 0.293 0.078 0.05
SOIC2001 20 SOIC PB-F86652-C-JMI 0.17 0.283 0.51 0.293 0.055 0.05
SOIC2002 20 SOP L20Z0-9020A 0.089 0.157 0.342 0.155 0.0225 0.025
SOIC2401 24 SOIC PB-F88153 0.17 0.283 0.606 0.293 0.057 0.05
SOIC2402 24 SOIC PB-F88153-JMI 0.17 0.283 0.606 0.293 0.057 0.05
SOIC2403 24 SOP L24Z0-9021A 0.089 0.157 0.342 0.155 0.0225 0.025
SOIC2801 28 SOIC PB-F88154-JMI 0.17 0.283 0.705 0.293 0.057 0.05
SOIC3201 32 SOJ PB-A99A20-A 0.31 0.73 0.832 0.423 0.08 0.05


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